zujuta 发表于 2025-8-14 12:22:32

LS1132配1/2.7芯片焦距f3.1mm光圈F2.2像面6.9视场角162度M8


LS1132规格书SPECIFICATION
项目(Item)规格参数(Parameter)
相对孔径 (F No.)2.2
焦距(Focal-Length)3.1mm
机械后焦(Flange Back Focal Length)3.2mm
最大像面大小(MAX Image circle)Ø6.9
镜片构成(Lens structure)1G3P
像素分辨率(Megapixel)3M
相对亮度(Relative illumination)>50%
接口(Mount )M8*0.5
芯片 (Sensor )1/2.71/2.91/3
视场角(FOV )DFOV(对角)162°144°132°
HFOV(水平)127°115°97°
VFOV(垂直)64°59°70°
畸变(TV Distortion)<25%
最大主光线夹角(Chief Ray Angle)<15°
光学总长(TTL)13.2mm
操作温度(Operating temperature)-20℃~+65℃
IP防护等级:0Tavg>=88% @420-600nmT=50% @650±10nmTavg<=5% @700-1050nm
尺寸(Size)
https://yelens.com/data/attachment/album/202508/14/121711tulg2cg7g83ma7z0.png

https://yelens.com/data/attachment/album/202509/10/221223c9p1rzaajcbaguz7.jpg
https://yelens.com/data/attachment/album/202509/10/221224w68jsb7l28u2sbbv.jpg
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